HPB-4B
High-Power Burn in with Test System
High-Power devices have become an industry standard. The HPB-4B Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs of high-power devices.
HPB-4B
Meeting the Challenge of High-Power Device Burn-In
Features:
- Individual temperature control for each device up to 600 W
- Test devices at a maximum temperature of 150°C with a liquid-cooled heat-sink per device
- Programmable clocks edges with 2-nanosecond edge resolution and 8 on-the-fly timing sets
- System capacity of 14 burn-in boards (112 devices)
- 12 vector formats per-pin per-cycle with memory testing extensions
- 19 programmable voltage regulators provide 2060 amps of device current per burn-in board
- High-speed clock programmable up to 800 MHz
- 128 I/O signals per board
- 64M vector memory, 8G scan
Benefits:
- Device temperature is maintained throughout test ensuring accurate readings
- Ensures proper thermal stress for each device
- Exercise and test high pin count devices or more parts in parallel
- More devices means higher throughputs which makes testing requirements more cost effective
- High current regulators to supply required power to DUTs
- Translate and run device test programs
- Clock devices with built-in self-test at high speed
- Test both logic and memory functions
- Run large numbers of test vectors without time-consuming reloads
- Flexible system protection control for more detailed reports of failures
- Allows user to start multiple BIBs at different times
