HPB-5C+
The Industry Standard for Burn-In of High Power Circuits
The HPB-5C+ Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs high-power VLSI devices. The active thermal control feature provided by the HPB-5C+ ensures that the proper thermal stress is applied to each device during the burn-in cycle.
HPB-5C+
The Clear Choice for High-Power Device Burn-In
Features:
- Individual temperature control for each device up to 150 W
- Variable oven overflow control
- Individual pattern zone per burn-in board slot
- 32M vector memory standard, 64M optional
- Tests devices at a temperature of up to 150°C
- Up to 800 MHz clock rate
- 128 digital I/O channels per burn-in board
- System capacity of 384 devices under test with individual temperature control per device
- 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board
- 8 high-current supplies
- (0-4 volts at up to 125 amps each)
- 8 low-current supplies
- (0-6 volts at up to 10 amps each)
Benefits:
- Testing capabilities for high-power devices
- Ensures proper thermal stress for each device
- Measures device temperature more accurately
- Testing is more cost-effective due to greater system capacity resulting in higher throughputs
- Exercise and test high pin count devices or more parts in parallel
- Run large numbers of test vectors without time-consuming reloads
- Up to 16 different pattern zones with one burn-in board per zone
- Up to 2000 Watts of device under test power available per slot
- Translate and run device test programs
- Clock devices with built-in self-test (BIST) at high speed
- Flexibility to test complex devices
- Stores failure information without slowing down the test
- Test both logic and memory functions
- Flexible system protection control for more detailed reports of failure
